LASER PROCESSING DEVICE

• Main Author: IIZUKA KENTARO
• Format: Patent
• Language: English; Japanese
• Published: 18.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a laser processing device which can measure a shape of a beam easily and safely while inhibiting size increase of the device.SOLUTION: A laser processing device includes: a chuck table 10 which holds a workpiece; a laser beam radiation unit 20 including a collector 23 which condenses and radiates a laser beam 21 to the workpiece held by the chuck table 10; a moving unit which moves the chuck table 10 and a focal point 211 of the laser beam 21 relative to each other; a measurement unit 50 which measures a beam profile of the laser beam 21; and a control unit which controls each component. The measurement unit 50 is provided adjacent to the chuck table 10 so as to have a light receiving surface 531 parallel to a holding surface 11 of the chuck table 10.SELECTED DRAWING: Figure 2 【課題】装置の大型化を抑制しつつ簡単かつ安全にビーム形状を測定することができるレーザー加工装置を提供すること。【解決手段】レーザー加工装置は、被加工物を保持するチャックテーブル１０と、チャックテーブル１０に保持された被加工物に対してレーザービーム２１を集光照射する集光器２３を備えたレーザービーム照射ユニット２０と、チャックテーブル１０とレーザービーム２１の集光点２１１とを相対的に移動させる移動ユニットと、レーザービーム２１のビームプロファイルを測定する測定ユニット５０と、各構成要素を制御する制御ユニットと、を備え、測定ユニット５０は、チャックテーブル１０の保持面１１と平行な受光面５３１を有するようにチャックテーブル１０に隣接して設けられる。【選択図】図２