WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

• Main Authors: ADACHI TAKEMA, MINOURA DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 17.08.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To improve the quality of a wiring board.SOLUTION: A wiring board 100 of an embodiment includes: a first conductor layer 11; a second insulating layer 22 formed on the first conductor layer 11; a connection conductor 4 connecting the first conductor layer 11 and a second conductor layer formed on the second insulating layer 22; and a coating film 5 to improve an adhesion between the first conductor layer 11 and the second insulating layer 22. The first conductor layer 11 includes a conductor pad 1a in contact with the connection conductor 4, and a wiring pattern 1b covered by the coating film 5. The conductor pad 1a has a surface facing the second insulating layer 22, the surface having a first surface roughness higher than the surface roughness of a surface 1b1 of the wiring pattern 1b. The conductor pad 1a has a surface 1a12 on a second conductor layer 22 side, the surface having an area 1a1 covered by the coating film 5 and a first area 1a11 exposed from the coating film 5. The connection conductor 4 is formed on the first area 1a11 and spaced from the coating film 4.SELECTED DRAWING: Figure 3 【課題】配線基板の品質向上。【解決手段】実施形態の配線基板１００は、第１導体層１１と、第１導体層１１の上に形成されている第２絶縁層２２と、第２絶縁層２２の上に形成されている第２導体層と第１導体層１１とを接続する接続導体４と、第１導体層１１と第２絶縁層２２との密着性を向上させる被覆膜５と、を備えている。第１導体層１１は、接続導体４と接する導体パッド１ａと、被覆膜５に覆われている配線パターン１ｂと、を含み、導体パッド１ａにおける第２絶縁層２２と向かい合う表面は、配線パターン１ｂの表面１ｂ１の面粗度よりも高い第１面粗度を有し、導体パッド１ａにおける第２導体層２２側の表面１ａ１は被覆膜５に覆われている領域１ａ１２と被覆膜５から露出する第１領域１ａ１１とを有し、接続導体４は、第１領域１ａ１１の上に形成されていて被覆膜４から離間している。【選択図】図３