SEMICONDUCTOR DEVICE AND TEMPERATURE MEASUREMENT METHOD

• Main Author: MASUDA SHINICHI
• Format: Patent
• Language: English; Japanese
• Published: 12.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; PHYSICS; SEMICONDUCTOR DEVICES; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR

To measure a temperature of each semiconductor element safely and accurately.SOLUTION: A semiconductor device (1) includes: a laminated substrate (3) having a plurality of circuit boards (31) formed on an upper surface of an insulating plate (30); a semiconductor element (4) having a main electrode (40) formed on its upper surface and arranged on an upper surface of a predetermined circuit board among the plurality of circuit boards; and a temperature measuring device (8) for measuring a temperature of the semiconductor element. The temperature measuring device has a cable part (80) made of an insulating optical fiber, and a temperature measuring part (81) provided at a tip of the cable part. The temperature measuring part is joined to the main electrode using a joining material (S).SELECTED DRAWING: Figure 5 【課題】半導体素子毎の温度を安全かつ高精度に測定すること。【解決手段】半導体装置（１）は、絶縁板（３０）の上面に複数の回路板（３１）が形成された積層基板（３）と、上面に主電極（４０）が形成され、複数の回路板のうち、所定の回路板の上面に配置された半導体素子（４）と、半導体素子の温度を測定する温度測定装置（８）と、を備える。温度測定装置は、絶縁性を有する光ファイバで構成されたケーブル部（８０）と、ケーブル部の先端に設けられた測温部（８１）と、を有する。測温部は、接合材（Ｓ）を用いて主電極に接合されている。【選択図】図５