PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PATTERN, CURED PRODUCT, INTERLAYER INSULATION FILM, COVER COAT LAYER, SURFACE PROTECTION FILM AND ELECTRONIC COMPONENT

• Main Authors: YAMAZAKI NORIYUKI, SAKAKIBARA SHIORI, MATSUKAWA DAISAKU
• Format: Patent
• Language: English; Japanese
• Published: 29.07.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a photosensitive resin composition that can form a cured product having high resolution even when cured at low temperatures of 200°C or lower, a method for producing a cured pattern, a cured product, an interlayer insulation film, a cover coat layer, a surface protection film and an electronic component.SOLUTION: A photosensitive resin composition contains (A) a polyimide precursor having a polymerizable unsaturated bond, (B1) a polymerizable monomer having an aliphatic cyclic skeleton, and (C) a compound having an acyl phosphine oxide structure.SELECTED DRAWING: None 【課題】２００℃以下の低温硬化であっても、解像度に優れる硬化物を形成できる感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品を提供する。【解決手段】（Ａ）重合性の不飽和結合を有するポリイミド前駆体、（Ｂ１）脂肪族環状骨格を有する重合性モノマー、及び（Ｃ）アシルホスフィンオキシド構造を含む化合物を含有する感光性樹脂組成物。【選択図】なし