MASK SHEET FOR QFN SEMICONDUCTOR PACKAGE

• Main Authors: CHOI JAE WON, CHO YEONG SEOK, YOON KEUN YOUNG, CHO HYEONG JUN, KIM HYO RIM
• Format: Patent
• Language: English; Japanese
• Published: 08.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a mask sheet for a QFN semiconductor package with a slipping property between an adhesion layer and a reinforcement layer.SOLUTION: The mask sheet for a QFN semiconductor package comprises a support film 10, an adhesive layer 20 positioned on one face of the support film, and a reinforcement layer 30 positioned on a face of the support film opposite the face where the adhesive layer is positioned. The slip friction force of the reinforcement layer with respect to the adhesive layer is 700 gf/50 mm or less, and the mask sheet has an effect of preventing generation of bubbles and wrinkles regardless of long-term rolled storage.SELECTED DRAWING: Figure 1 【課題】接着層と補強層との間にスリップ性を付与したＱＦＮ半導体パッケージ用マスクシートを提供する。【解決手段】ＱＦＮ半導体パッケージ用マスクシートは、支持フィルム１０、支持フィルムの片面に位置した粘着層２０、支持フィルムの粘着層が位置した面とは反対側の面に位置した補強層３０、とを含み、粘着層に対する補強層のスリップ摩擦力が７００ｇｆ／５０ｍｍ以下に相当し、長期間巻き取り保管にもかかわらず、気泡やシワが発生しない効果を有する。【選択図】図１