ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

• Main Authors: YOSHIKAWA KAZUHIRO, OHASHI TAKESHI, TSUNODA KOICHI, TOMIKAWA MITSUHIRO, IIOKA AKIYASU
• Format: Patent
• Language: English; Japanese
• Published: 08.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide an electronic component having a structure in which moisture infiltrated along the surface of a base material does not easily reach an internal electrode layer.SOLUTION: An electronic component 1 includes a flattening layer 3, a conductor layer M1, a dielectric film 4, and a conductor layer MM provided in the central region 2a of a base material 2. An outer peripheral region 2b of the base material 2 has a lower surface position than the central region 2a, and is covered with an insulating resin layer 11 without interposing the flattening layer 3 and the dielectric film 4. In the outer peripheral region of the flattening layer 3 and the dielectric film 4, the flattening layer 3 and the dielectric film 4 are in contact with each other without the intervention of the conductor layer M1. A stepped surface 2s of the base material 2, and the end surfaces 3s and 4s of the flattening layer 3 and the dielectric film 4 are tapered. In this way, since the conductor layer M1 is not exposed on the tapered end face, it is difficult for the water to reach the conductor layer M1 even when water infiltrates from the outside along the surface of the base material 2.SELECTED DRAWING: Figure 1 【課題】基材の表面に沿って浸入した水分が内部電極層に到達しにくい構造を有する電子部品を提供する。【解決手段】電子部品１は、基材２の中央領域２ａに設けられた平坦化層３、導体層Ｍ１、誘電体膜４、導体層ＭＭを備える。基材２の外周領域２ｂは、中央領域２ａよりも表面の位置が低く、且つ、平坦化層３及び誘電体膜４を介することなく絶縁樹脂層１１で覆われている。平坦化層３及び誘電体膜４の外周領域においては、導体層Ｍ１が介在することなく両者が接している。基材２の段差面２ｓ、平坦化層３及び誘電体膜４の端面３ｓ，４ｓはテーパー状である。このように、テーパー状にエッチングされた端面に導体層Ｍ１が露出しないことから、基材２の表面に沿って外部から水分が浸入した場合であっても、水分が導体層Ｍ１に到達しにくい。【選択図】図１