SOLID MATERIAL

To provide a solid material capable of improving heat insulation performance.SOLUTION: A disclosed solid material 1a has a 3D structure 10. The 3D structure 10 has multiple recesses 12 and a solid part 14. The solid part 14 is formed between the recesses 12. The 3D structure 10 regulates the thermal...

Full description

Saved in:
Bibliographic Details
Main Authors TAKAHASHI KOHEI, NAITO YASUYUKI, TAMBO NAOKI, FUJIKANE MASAKI
Format Patent
LanguageEnglish
Japanese
Published 07.07.2022
Subjects
ELECTRICITY
MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES
NANOTECHNOLOGY
PERFORMING OPERATIONS
SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:To provide a solid material capable of improving heat insulation performance.SOLUTION: A disclosed solid material 1a has a 3D structure 10. The 3D structure 10 has multiple recesses 12 and a solid part 14. The solid part 14 is formed between the recesses 12. The 3D structure 10 regulates the thermal conductivity of the solid material 1a by interacting with phonons. The minimum dimension N of the solid part 14 between the adjacent recesses 12 in the plan view of the 3D structure 10 is 100 nm or less. The solid part 14 includes a part 14p that has an elastic modulus Ep of 80% or less of the elastic modulus Er of the reference sample.SELECTED DRAWING: Figure 1 【課題】固体材料の断熱性能を高める観点から有利な技術を提供する。【解決手段】本開示の固体材料１ａは、三次元構造１０を備えている。三次元構造１０は、複数の凹部１２と、固体部１４とを有する。固体部１４は、凹部１２同士の間に形成されている。三次元構造１０は、フォノンとの相互作用により固体材料１ａの熱伝導率を調節する。三次元構造１０の平面視において隣り合う凹部１２同士の間における固体部１４の最小寸法Ｎは、１００ｎｍ以下である。固体部１４は、参考サンプルの弾性率Ｅｒの８０％以下の弾性率Ｅｐを有する部位１４ｐを含む。【選択図】図１
Bibliography:Application Number: JP20200217806