RESIN COMPOSITION FOR CYLINDRICAL MOLDING FOR LASER BEAM WELDING, AND CYLINDRICAL MOLDING FOR LASER BEAM WELDING USING THE SAME, AND CYLINDRICAL MOLDING-TUBE BOND STRUCTURE
To provide a resin composition for a cylindrical molding for laser beam welding which can improve weldability when a cylindrical molding such as a connector for a tube for an automobile is welded by a laser beam, a cylindrical molding for laser beam welding using the same, and a bond structure obtai...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
07.07.2022
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a resin composition for a cylindrical molding for laser beam welding which can improve weldability when a cylindrical molding such as a connector for a tube for an automobile is welded by a laser beam, a cylindrical molding for laser beam welding using the same, and a bond structure obtained by welding the cylindrical molding for laser beam welding and a tube by a laser beam.SOLUTION: A resin composition for a cylindrical molding for laser beam welding contains the following components (A) to (C) in a specific ratio as a material of a connector 1 welded to a resin tube 2 by a laser beam. (A) At least one selected from the group consisting of polypropylene and polyamide (excluding (C)). (B) Glass fiber filler having a refractive index whose difference with the refractive index of (A) is 0.02 or less. (C) Compatibilizer having the same constitutional unit as the main chain of (A), and having a functional group showing reactivity to a hydroxyl group of the surface of (B) the glass fiber filler.SELECTED DRAWING: Figure 1
【課題】自動車用チューブ用のコネクタのような筒状成形体をレーザー溶着する際の溶着性を改善することができる、レーザー溶着用筒状成形体用樹脂組成物およびそれを用いたレーザー溶着用筒状成形体、並びに、上記レーザー溶着用筒状成形体とチューブとがレーザー溶着されてなる結合構造体を提供する。【解決手段】樹脂チューブ2とレーザー溶着されるコネクタ1の材料として、下記の(A)~(C)成分を特定の割合で含有するレーザー溶着用筒状成形体用樹脂組成物を用いる。(A)ポリプロピレンおよびポリアミドからなる群から選ばれた少なくとも一つ(但し、(C)を除く)。(B)上記(A)の屈折率との差が0.02以内の屈折率を示す、ガラス繊維フィラー。(C)上記(A)の主鎖と同一の構成単位を有し、かつ上記(B)のガラス繊維フィラー表面の水酸基に反応性を示す官能基を有する、相溶化剤。【選択図】図1 |
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Bibliography: | Application Number: JP20200216909 |