ELECTRONIC DEVICE

• Main Author: MIYAKE TOSHIHIRO
• Format: Patent
• Language: English; Japanese
• Published: 07.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide an electronic device that can improve heat dissipation.SOLUTION: An electronic device includes a heating element 40 that includes at least a heating component, a case 21 that dissipates heat from the heating element, a heat conductive member 50 that transfers the heat of the heating element to a heat dissipation member, a metal bonding layer 60 that includes at least first bonding layers 60a, 60b made of gold or a gold alloy and is interposed between the heating element and the heat conductive member to bond the heating element and the heat conductive member. The thickness of the metal bonding layer is smaller than the flatness of the bonding region with the metal bonding layer on the facing surface of the heating element and the facing surface of the heat conductive member. The heat conductive member has flexibility, is bonded to the heating element via the metal bonding layer, and is in contact with the case.SELECTED DRAWING: Figure 2 【課題】放熱性を向上できる電子装置を提供すること。【解決手段】電子装置は、発熱部品を少なくとも含む発熱体４０と、発熱体の熱を放熱するケース２１と、発熱体の熱を放熱部材に伝達する熱伝導部材５０と、金または金合金を材料とする第１接合層６０ａ、６０ｂを少なくとも含み、発熱体と熱伝導部材との間に介在して発熱体と熱伝導部材とを接合する金属接合層６０を備える。金属接合層の厚みは、発熱体の対向面および熱伝導部材の対向面における金属接合層との接合領域の平面度よりも小さい。熱伝導部材は、柔軟性を有しており、金属接合層を介して発熱体と接合され、ケースに接触している。【選択図】図２