POLYAMIDE ACID COMPOSITION, POLYIMIDE COMPOSITION, METAL-CLAD LAMINATE SHEET, AND CIRCUIT BOARD

• Main Authors: ANDO TOMONORI, YAMADA HIROAKI
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To impart desired thermal conductivity, and even a desired "thermal expansion coefficient" and excellent "adhesion to a metal layer" to a polyimide formed of a polyamide acid composition obtained by dispersing and mixing thermally conductive filler in polyamide acid without deteriorating dielectric properties.SOLUTION: A polyamide acid composition including: polyamide acid having a diamine residue induced from a diamine component and an acid anhydride residue induced from a tetracarboxylic dianhydride component; and α-alumina fine particles includes 20 to 80 pts.vol. of the α-alumina fine particles having an average particle size D50 of 2 μm or more and 10 μm or less to 100 pts.vol. of the polyamide acid. The diamine residue induced from the diamine component includes 10 mol% or more of a diamine residue having a biphenyl structure; and the acid anhydride residue induced from the tetracarboxylic dianhydride component includes 50 mol% or more of an acid anhydride residue having a biphenyl structure.SELECTED DRAWING: None 【課題】ポリアミド酸に熱伝導性フィラーを分散混合したポリアミド酸組成物から形成したポリイミドに、誘電特性を悪化させることなく所望の熱伝導性を付与でき、しかも所望の"熱膨張係数"や良好な"金属層に対する密着性"をも付与できるようにする。【解決手段】ジアミン成分から誘導されたジアミン残基と、テトラカルボン酸二無水物成分から誘導された酸無水物残基とを有するポリアミド酸と、α－アルミナ微粒子とを含有するポリアミド酸組成物は、平均粒子径Ｄ５０が２μｍ以上１０μｍ以下のα－アルミナ微粒子を、ポリアミド酸１００体積部に対し２０～８０体積部で含有する。ジアミン成分から誘導されたジアミン残基は、ビフェニル構造を有するジアミン残基を１０モル％以上含有し、テトラカルボン酸二無水物成分から誘導された酸無水物残基は、ビフェニル構造を有する酸無水物残基を５０モル％以上含有する。【選択図】なし