CURABLE COMPOSITION AND METHOD FOR MANUFACTURING JOINT STRUCTURE

• Main Author: KUROSAWA TSUYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a curable composition which exhibits good adhesiveness without being heated at a high temperature, and a method for manufacturing a joint structure using the curable composition.SOLUTION: The curable composition is used for forming an adhesive layer bonding two or more adherends, at least one of which contains a low heat-resistant material. The curable composition contains an epoxy resin containing a constituent unit of a specific structure containing an epoxy group and gives a cured product having a water contact angle of 40-50° (inclusive) by heating at 80-100°C (inclusive) and exposure.SELECTED DRAWING: None 【課題】高温で加熱を行わずとも良好な接着性を発現する硬化性組成物と、当該硬化性組成物を用いる接合構造体の製造方法とを提供すること。【解決手段】２以上の被接着物を接着する接着層を形成するために用いられ、２以上の被接着物の少なくとも１つが、低耐熱性材料を含む硬化性組成物として、エポキシ基を含む特定の構造の構成単位を含むエポキシ樹脂を含有し、８０℃以上１００℃以下での加熱と、露光とにより、水の接触角が４０°以上５０°以下である硬化物を与える硬化性組成物を用いる。【選択図】なし