RESIST INK, ETCHING METHOD, AND ELECTRONIC APPARATUS

• Main Authors: SUGANO TSUTOMU, TAKEDA HIROYUKI, NAKAMURA HIDEMI, YAMADA SHINJIRO
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2022
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; USE OF MATERIALS THEREFOR; WOODSTAINS

To provide resist ink which is excellent in adhesion to a metallic foil and etching resistance even when a baking temperature is set to be lower than a conventional baking temperature (for example, 150°C or lower), a metallic foil etching method using the resist ink, and an electronic apparatus manufactured using the resist ink.SOLUTION: There are provided resist ink which contains an acid group-containing olefin resin (A) having crystallinity and a melting point of 50°C or higher and 150°C or lower and an organic solvent (B); a metallic foil etching method using the resist ink; and an electronic apparatus manufactured using the resist ink.SELECTED DRAWING: None 【課題】 焼付温度を従来より低温（例えば１５０℃以下）とした場合でも金属箔との密着性、耐エッチング性に優れたレジストインキ、当該レジストインキを用いた金属箔エッチング方法、当該レジストインキを用いて製造された電子機器を提供する。【解決手段】 結晶性を有し、融点が５０℃以上１５０℃である酸基含有オレフィン樹脂（Ａ）と、有機溶剤（Ｂ）とを含むレジストインキ、当該レジストインキを用いた金属箔エッチング方法、当該レジストインキを用いて製造された電子機器。【選択図】 なし