SUPPORT UNIT AND APPARATUS FOR TREATING SUBSTRATE

To provide a support unit and a substrate treating apparatus that are capable of efficiently treating a substrate.SOLUTION: Provided is a support unit that is included in an apparatus for treating a substrate using plasma and is configured to support the substrate. The support unit may include: a po...

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Main Authors KIM SUNG JE, KIM DONG SUK, OGSEN GALSTYAN, BAE MIN KEUN, AN JONG-HWAN, CHO JAE HYUN, LEE WON SEOK, KIM HYUN-KYU, SON HYOUNGKYU
Format Patent
LanguageEnglish
Japanese
Published 30.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a support unit and a substrate treating apparatus that are capable of efficiently treating a substrate.SOLUTION: Provided is a support unit that is included in an apparatus for treating a substrate using plasma and is configured to support the substrate. The support unit may include: a power supply rod connected to a high-frequency power supply; an electrode plate configured to receive power from the power supply rod; and a ground ring that is provided to surround the electrode plate and is grounded.SELECTED DRAWING: Figure 1 【課題】基板を効率的に処理することができる支持ユニット及び基板処理装置を提供する。【解決手段】本発明はプラズマを利用して基板を処理する装置が有し、基板を支持する支持ユニットを提供する。支持ユニットは、高周波電源と連結される電力供給ロードと、前記電力供給ロードから電力が伝達される電極板と、前記電極板を囲むように提供され、接地されるグラウンドリングと、を含むことができる。【選択図】図１
Bibliography:Application Number: JP20210199463