ASSEMBLY WALL, CONSTRUCTION METHOD OF ASSEMBLY WALL, SUPPORT FOR ASSEMBLY WALL, ASSEMBLY METHOD OF SUPPORT FOR ASSEMBLY WALL, AND SUPPORT MEMBER FOR ASSEMBLY WALL

To provide an assembly wall that can be easily installed or constructed, a method for constructing this assembly wall, a support for the assembly wall provided for this assembly wall, an assembling method of the support for the assembly wall for assembling this support for the assembly wall, and a s...

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Main Authors MOCHIZUKI YOSHINOBU, ITO MAKOTO, KUDO TERUAKI, AONO TAKASHI, KAWAHARA KEIJI, MIZUTANI AKIRA
Format Patent
LanguageEnglish
Japanese
Published 21.06.2022
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Summary:To provide an assembly wall that can be easily installed or constructed, a method for constructing this assembly wall, a support for the assembly wall provided for this assembly wall, an assembling method of the support for the assembly wall for assembling this support for the assembly wall, and a support member for the assembly wall provided for the support for the assembly wall.SOLUTION: Support members 12 for the assembly wall are deployed on a foundation F at a width of a bulkhead plate 2 to be installed in a vertical position, and are erected on a foundation 11 provided with a plurality of vertical guide tubes spaced at intervals greater than a thickness of a bulkhead plate 2. The support member 12 for the assembly wall is provided with a column body and a plurality of rods. The column body has a pair or more flanges having a thickness enough to sandwich an edge of the bulkhead plate 2 and protruding from the column body to sandwich the edge of the bulkhead plate 2. The plurality of rods are inserted into each guide tube.SELECTED DRAWING: Figure 1 【課題】容易に設置したり構築したりすることができる組立壁、この組立壁の施工方法、この組立壁に備えられた組立壁用支柱、この組立壁用支柱を組み立てる組立壁用支柱の組立方法、及び、組立壁用支柱に備えられた組立壁用支柱部材を提供する。【解決手段】組立壁用支柱部材12は、鉛直姿勢で設置される隔壁板2の幅で基盤Fに配備され、かつ、複数本の鉛直姿勢のガイド管を隔壁板2の厚さ以上の間隔をもって備えた基礎部11上に立設される。組立壁用支柱部材12は、柱本体と複数本のロッドを備えている。柱本体は、隔壁板2の端部を挟む厚さを有し、隔壁板2の端部を挟むように柱本体から突出した一対以上のフランジを有している。複数本のロッドは、各ガイド管内に挿入される。【選択図】図1
Bibliography:Application Number: JP20200203865