ADHESIVE FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

• Main Authors: MORIYA TOSHIMITSU, KOBAYASHI RYOTA, ICHIMURA TAKEYUKI, TOMISAKA KATSUHIKO
• Format: Patent
• Language: English; Japanese
• Published: 09.06.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; DYES; ELECTRICITY; INSULATORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

To provide an adhesive for circuit connection which gives a connection structure having sufficiently low connection resistance between electrodes facing each other by thermocompression bonding at a low temperature in a short time.SOLUTION: The adhesive for circuit connection contains a cationically polymerizable compound, a thermal cationic polymerization initiator, and conductive particles. The cationically polymerizable compound contains an alicyclic epoxy compound, and the thermal cationic polymerization initiator contains an onium salt having an anion represented by the following formula (1). A connection structure having sufficiently low connection resistance between electrodes facing each other can be obtained by thermocompression bonding at a low temperature in a short time using the adhesive for circuit connection.SELECTED DRAWING: Figure 1 【課題】低温短時間での熱圧着により、対向する電極間の接続抵抗が充分に低い接続構造体を得る回路接続用接着剤を提供する。【解決手段】回路接続用接着剤は、カチオン重合性化合物と、熱カチオン重合開始剤と、導電粒子と、を含有する。カチオン重合性化合物は、脂環式エポキシ化合物を含み、熱カチオン重合開始剤が、下記式（１）で表されるアニオンを有するオニウム塩を含む。回路接続用接着剤により、低温短時間での熱圧着により、対向する電極間の接続抵抗が十分に低い接続構造体を得ることができる。TIFF2022086478000013.tif46149【選択図】図１