SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

• Main Authors: OKITA YUJI, HIGASHI KATSUE, ISHIMARU KEI, ENDO TORU, YAMAGUCHI TAKAHIRO, NAOHARA EIJI, TSUKAHARA RYUTA
• Format: Patent
• Language: English; Japanese
• Published: 09.06.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate processing method and a substrate processing apparatus that can satisfactorily detect the end of processing of a surface to be processed of a surface with a processing liquid.SOLUTION: A removal liquid (processing liquid) is supplied to an upper surface (surface to be processed) of a substrate W while rotating the substrate W held at a holding position surrounded by a tubular first guard 30A around a rotation axis A1 (processing liquid supply step). While the removing liquid is being supplied to the upper surface of the substrate W, an image of the upper surface of the substrate W and an image of an inner wall surface 30a of a first guard 30A are acquired (image acquisition step). A brightness value of the image obtained in the image acquisition step is monitored, and a processing end time point is detected (detection step).SELECTED DRAWING: Figure 2 【課題】処理液による基板の被処理面に対する処理の終了を良好に検出することができる基板処理方法および基板処理装置を提供する。【解決手段】筒状の第１ガード３０Ａによって取り囲まれる保持位置に保持されている基板Ｗを回転軸線Ａ１まわりに回転させながら除去液（処理液）が基板Ｗの上面（被処理面）に供給される（処理液供給工程）。基板Ｗの上面に除去液を供給している間に、基板Ｗの上面の画像および第１ガード３０Ａの内壁面３０ａの画像が取得される（画像取得工程）。画像取得工程で得られた画像の輝度値が監視されて、処理終了時点が検出される（検出工程）。【選択図】図２