CERAMIC HEATER

To facilitate achievement of desired temperature distribution.SOLUTION: A ceramic heater 10 comprises a discoidal ceramic plate 20 with a wafer mounting surface, and a shaft 40 provided on the surface of the ceramic plate 20 opposite to the wafer mounting surface. First and second resistance heat-ge...

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Bibliographic Details
Main Authors UNNO YUTAKA, HARA TOMOHIRO
Format Patent
LanguageEnglish
Japanese
Published 09.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To facilitate achievement of desired temperature distribution.SOLUTION: A ceramic heater 10 comprises a discoidal ceramic plate 20 with a wafer mounting surface, and a shaft 40 provided on the surface of the ceramic plate 20 opposite to the wafer mounting surface. First and second resistance heat-generating elements 21 and 22 are embedded in the ceramic plate 20. When the ceramic plate 20 is viewed from above, a gap (first gap 21d) between first folded portions 21b and 21c facing each other in the circumferential direction and a gap (second gap 22d) between second folded portions 22b and 22c facing each other in the circumferential direction are arranged in such a manner that the gaps do not overlap with each other.SELECTED DRAWING: Figure 2 【課題】目的とする温度分布を達成しやすくする。【解決手段】セラミックヒータ１０は、ウエハ載置面を有する円盤状のセラミックプレート２０と、セラミックプレート２０のウエハ載置面とは反対側の面に設けられたシャフト４０とを備える。セラミックプレート２０の内部には、第１及び第２抵抗発熱体２１，２２が埋設されている。セラミックプレート２０を上から見たとき、円周方向で互いに向かい合う第１折り返し部２１ｂ，２１ｃ同士の間隙（第１間隙２１ｄ）と円周方向で互いに向かい合う第２折り返し部２２ｂ，２２ｃ同士の間隙（第２間隙２２ｄ）とは重ならないように配置されている。【選択図】図２
Bibliography:Application Number: JP20200197814