ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINT CIRCUIT BOARD

• Main Authors: KASAHARA MASAYASU, SHINOZAKI ATSUSHI, TAKASAWA RYOJI, KATAHIRA SHUSUKE, NAKASAKI RYUSUKE, SANO JUNRO
• Format: Patent
• Language: English; Japanese
• Published: 08.06.2022
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

To provide a roughened copper foil that enables the manufacture of a print circuit board, etc. having excellent adhesion with a resin, low transmission loss, and a low risk of a short circuit due to migration.SOLUTION: A roughened copper foil has a roughened surface on which a plurality of roughening particles 1 are formed on at least one surface, with ruggedness formed on the surface of the roughening particles 1. The expansion area ratio Sdr of the interface of the roughened surface measured with a three-dimensional white light interference type microscope is 1000% or more and 5000% or less, and the arithmetic average roughness Sa of the roughened surface is 0.04 μm or more and 0.6 μm or less.SELECTED DRAWING: Figure 1 【課題】樹脂との密着性に優れ、伝送損失が小さく、且つ、マイグレーションによる短絡が生じにくいプリント配線板等を製造可能な粗化処理銅箔を提供する。【解決手段】粗化処理銅箔は、複数の粗化粒子１が形成された粗化処理面を少なくとも一方の面に有し、粗化粒子１の表面には凹凸が形成されている。そして、３次元白色光干渉型顕微鏡を用いて測定した粗化処理面の界面の展開面積率Ｓdrが１０００％以上５０００％以下であり、且つ、粗化処理面の算術平均粗さＳａが０．０４μｍ以上０．６μｍ以下である。【選択図】図１