HIGH-FREQUENCY SUBSTRATE

• Main Author: ASAHI YASUAKI
• Format: Patent
• Language: English; Japanese
• Published: 08.06.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE; WAVEGUIDES

To provide a high-frequency substrate that can achieve impedance matching in a high frequency range.SOLUTION: A high-frequency substrate includes a first substrate, a second substrate laminated on the surface of the first substrate, a first metal layer that covers the inner surface of a through hole that communicates from the front surface of the second substrate to the back surface of the first substrate, a first strip line provided on the surface of the second substrate, a second strip line provided on the back surface of the first substrate and electrically connected to the first strip line via the first metal layer, and a second metal layer extending between the first substrate and the second substrate and provided apart from the first metal layer. The second substrate includes a first region, a second region, and a third region arranged in a direction along the surface of the first substrate, and the third region is provided between the first region and the second region, and in the second region and the third region, a recess is provided on the surface side of the second substrate.SELECTED DRAWING: Figure 1 【課題】高周波領域においてインピーダンス整合を実現できる高周波基板を提供する。【解決手段】高周波基板は、第１基板と、前記第１基板の表面上に積層された第２基板と、前記第２基板の表面から前記第１基板の裏面に連通する貫通孔の内面を覆う第１金属層と、前記第２基板の表面上に設けられた第１ストリップ線路と、前記第１基板の裏面上に設けられ、前記第１金属層を介して前記第１ストリップ線路に電気的に接続された第２ストリップ線路と、前記第１基板と前記第２基板との間に延在し、前記第１金属層から離間して設けられた第２金属層と、を備える。前記第２基板は、前記第１基板の前記表面に沿った方向に並ぶ第１領域、第２領域および第３領域を含み、前記第３領域は、前記第１領域と前記第２領域との間に設けられ、前記第２領域および前記第３領域は、前記第２基板の前記表面側に凹部を設ける。【選択図】図１