SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

• Main Authors: TANUMA YUSUKE, AKIBA TOSHIHIKO
• Format: Patent
• Language: English; Japanese
• Published: 01.06.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To improve performance of a semiconductor device.SOLUTION: A semiconductor device comprises: a wiring board; a semiconductor chip CHP1 that is mounted on the wiring board; a heat dissipation sheet TIM that is arranged to cover all of the semiconductor chip CHP1 on the semiconductor chip CHP1 and that is larger in area than the semiconductor chip CHP1; and a cover member LID to which the heat dissipation sheet TIM is fixed. The cover member LID comprises: a part LID1 that faces the semiconductor chip CHP1; a flange part LIDf that is arranged around the part LID1 and that is bonded to fix on the wiring board; and a part LID2 that is present between the part LID1 and the flange part LIDf. In a plan view in which the cover member LID is viewed from a heat dissipation sheet TIM side, the heat dissipation sheet TIM is bonded to fix on the cover member LID through an adhesive member BND2 which is partially arranged between the heat dissipation sheet TIM and the cover member LID.SELECTED DRAWING: Figure 5 【課題】半導体装置の性能を向上させる。【解決手段】半導体装置は、配線基板と、配線基板上に搭載される半導体チップＣＨＰ１と、半導体チップＣＨＰ１上に半導体チップＣＨＰ１の全体を覆うように配置され、半導体チップＣＨＰ１よりも面積が大きい放熱シートＴＩＭと、半導体チップＣＨＰ１および放熱シートＴＩＭ、かつ、放熱シートＴＩＭが固定されたカバー部材ＬＩＤと、を有する。カバー部材ＬＩＤは、半導体チップＣＨＰ１と対向する部分ＬＩＤ１と、部分ＬＩＤ１の周囲に配置され、配線基板上に接着固定されるフランジ部分ＬＩＤｆと、部分ＬＩＤ１とフランジ部分ＬＩＤｆとの間にある部分ＬＩＤ２と、を有する。放熱シートＴＩＭ側からカバー部材ＬＩＤを視た平面視において、放熱シートＴＩＭは、放熱シートＴＩＭとカバー部材ＬＩＤとの間に部分的に配置された接着部材ＢＮＤ２を介してカバー部材ＬＩＤに接着固定されている。【選択図】図５