WAFER JOINT DEVICE

• Main Authors: MOROISHI FUMITAKA, KAJINAMI MASAHITO, SUGIURA TAKAMASA
• Format: Patent
• Language: English; Japanese
• Published: 27.05.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a wafer joint device that can accurately control the bending state and parallelism of a wafer to be joined, suppress the positional deviation due to the strain of the wafer, perform high-precision bonding and void-free joining, and improve productivity by monitoring the joining status of the wafer.SOLUTION: A wafer joint device 100 includes: a first chuck 101 with a hole in the center of a surface holding a wafer; a second chuck 102; a pressing portion 103-1 for pressing the wafer in a direction of the second chuck 102 through the hole; and an air bearing 104 provided between the pressing portion 103-1 and the first chuck 101 to suppress the positional deviation of the pressing portion 103-1 in a holding surface direction.SELECTED DRAWING: Figure 1 【課題】接合するウェハの湾曲状態，平行度を正確に制御し，ウェハのひずみによる位置ずれを抑え，高精度なボンディングとボイドのない接合ができ，かつウェハの接合状況を監視することにより生産性を向上させることができるウェハ接合装置を提供すること。【解決手段】ウェハ接合装置１００は，ウェハを保持する面の中央に穴を有する第１チャック１０１と，第２チャック１０２と，穴を介してウェハを第２チャック１０２方向に押圧する押圧部１０３－１と，押圧部１０３と第１チャック１０１との間に設けられ，保持する面方向での押圧部１０３－１の位置ずれを抑えるエアベアリング１０４と，を備える。【選択図】図１