LAMINATED SEMICONDUCTOR DEVICE

To provide a laminated semiconductor device capable of being hermetically sealed even when using a semiconductor chip in which a pitch interval between an input electrode and an output electrode is made fine.SOLUTION: A laminated semiconductor device includes an upper semiconductor substrate 11B, an...

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Bibliographic Details
Main Author MOTOYOSHI MAKOTO
Format Patent
LanguageEnglish
Japanese
Published 17.05.2022
Subjects
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