LAMINATED SEMICONDUCTOR DEVICE
To provide a laminated semiconductor device capable of being hermetically sealed even when using a semiconductor chip in which a pitch interval between an input electrode and an output electrode is made fine.SOLUTION: A laminated semiconductor device includes an upper semiconductor substrate 11B, an...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
17.05.2022
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Subjects | |
Online Access | Get full text |
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