WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

• Main Author: NAGATA HIROYASU
• Format: Patent
• Language: English; Japanese
• Published: 12.05.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a wiring board that has a recess that can accommodate thick electronic components and can be manufactured at low cost.SOLUTION: A wiring board of the embodiment has a core substrate 10 having an insulating substrate 5, a first side conductor layer 3 and a second side conductor layer 4 provided on the insulating substrate 5, a first build-up layer 11 formed on the first side and the first side conductor layer 3 of the insulating substrate 5 and consisting of a first interlayer insulating layer 32 and a first conductor layer 31 laminated together, a second build-up layer 12 formed on the second side and the second side conductor layer 4 of the insulating substrate 5 and consisting of a second interlayer insulating layer 42 and a second conductor layer 41 laminated together. A recess 7 is provided through at least the insulating substrate 5, the second side conductor layer 4, and the second build-up layer 12, and the entire bottom surface 7a of the recess 7 is formed of a conductor.SELECTED DRAWING: Figure 1 【課題】厚い電子部品を収容し得る凹部を有し、低コストで製造され得る配線基板の提供。【解決手段】実施形態の配線基板は、絶縁基板５、絶縁基板５に設けられる第１面側導体層３および第２面側導体層４を有するコア基板１０と、絶縁基板５の第１面および第１面側導体層３上に形成されていて第１層間絶縁層３２と第１導体層３１とを積層してなる第１ビルドアップ層１１と、絶縁基板５の第２面および第２面側導体層４上に形成されていて第２層間絶縁層４２と第２導体層４１とを積層してなる第２ビルドアップ層１２とを有している。そして、少なくとも絶縁基板５と第２面側導体層４と第２ビルドアップ層１２とを貫通する凹部７が設けられ、凹部７の底面７ａ全体が導体で形成されている。【選択図】図１