SUBSTRATE PROCESSING SYSTEM, CONTROL METHOD, AND CONTROL PROGRAM

• Main Authors: MOHD FAIRUZ BIN BUDIMAN, TAKAYOSHI JOJI, KINO SHU
• Format: Patent
• Language: English; Japanese
• Published: 28.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To prevent the application of an unacceptable voltage to a specific component of a substrate processing device.SOLUTION: A substrate processing system includes a substrate processing device including a processing container that processes a substrate and a DC power supply that applies a DC voltage to a specific part in the processing container, and a control unit that controls the substrate processing device, and processing executed by the control unit includes processing of acquiring a measured value of the DC voltage measured during the processing of the substrate based on a desired processing condition and the processing condition, and processing of creating a regression analysis formula for calculating an estimated value of the DC voltage using a plurality of conditions among the processing conditions as explanatory variables on the basis of the acquired processing conditions and the measured values of the DC voltage.SELECTED DRAWING: Figure 8 【課題】許容範囲外の電圧を基板処理装置の特定パーツに印加することを未然に防止する。【解決手段】基板の処理を行う処理容器と、前記処理容器内の特定パーツに直流電圧を印加する直流電源と、を有する基板処理装置と、前記基板処理装置を制御する制御部と、を有する基板処理システムであって、前記制御部が実行する処理は、所望のプロセス条件に基づく基板の処理中に測定した前記直流電圧の実測値と前記プロセス条件とを取得する処理と、取得した前記プロセス条件と前記直流電圧の実測値とに基づき、前記プロセス条件のうちの複数の条件を説明変数として、前記直流電圧の推定値を算出する回帰分析式を作成する処理と、を含む基板処理システムが提供される。【選択図】図８