METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE

• Main Authors: FUJINO JUNJI, KAWAZOE CHIKA
• Format: Patent
• Language: English; Japanese
• Published: 28.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a method for manufacturing a semiconductor device capable of suppressing adhesion of a foreign material to a sealing member injected into a case and occurrence of poor appearance, the semiconductor device, and a power conversion device.SOLUTION: A method for manufacturing a semiconductor device comprises a semiconductor element arranging step, a junction part forming step, a substrate installing step, an electrode connecting step, a lid part arranging step, a sealing member injecting step, and a sealing part forming step. The semiconductor element arranging step arranges semiconductor elements 2 and 3 on a substrate 1. The substrate installing step installs the substrate 1 in a case 4. The electrode connecting step connects the semiconductor elements 2 and 3, and an external terminal by an electrode connection part. The lid part arranging step arranges a lid part including a first opening 90a in a side wall part 40a2 so as to cover an opening formed by the side wall part 40a2. The sealing member injecting step injects a sealing member from an injection nozzle connected to the first opening 90a formed through the lid part. The sealing part forming step cures the sealing member injected into a space, covers the substrate 1, the junction part, the semiconductor elements 2 and 3, the external terminal, and at least a part of the electrode connection part, and forms a sealing part so as to expose a second conductor layer of the substrate 1.SELECTED DRAWING: Figure 2 【課題】ケースの内部に注入された封止部材に異物が付着することを抑制でき、外観不良の発生を抑制できる半導体装置の製造方法、半導体装置及び電力変換装置を提供する。【解決手段】基板１に、半導体素子２、３を配置し、接続する半導体素子配置工程、接合部形成工程と、ケース４に基板１を設置する基板設置工程と、電極接続部によって半導体素子２、３及び外部端子を接続する電極接続工程と、側壁部４０ａ２により形成された開口を覆うように、側壁部４０ａ２に、第１の開口部９０ａを有する蓋部を配置する蓋部配置工程と、蓋部を貫通して形成された第１の開口部９０ａに接続された注入ノズルから、封止部材を注入する封止部材注入工程と、空間に注入された封止部材を硬化させ、基板１、接合部、半導体素子２、３、外部端子及び電極接続部の少なくとも一部を覆うとともに、基板１の第２の導体層を露出するように封止部を形成する封止部形成工程と、を有する。【選択図】図２