PLATING METHOD

• Main Author: TSUJI KAZUHITO
• Format: Patent
• Language: English; Japanese
• Published: 21.04.2022
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

To prevent a pre-wet solution from residing on a marginal part of a substrate.SOLUTION: A plating method is provided for performing a plating treatment onto a substrate having a to-be-plated part that is exposed to a plating solution and a marginal part that is an outer area of the to-be-plated part. The plating method includes: a first sealing step of sealing the marginal part of the substrate while a first seal body contacts the substrate; a pre-wet step of performing a pre-wet treatment onto the sealed substrate; a first seal removing step of removing the first seal body from the substrate after the pre-wet treatment; a substrate holding step of holding the substrate with a substrate holder having a second seal body; and a plating step of applying the plating solution to the substrate held by the substrate holder.SELECTED DRAWING: Figure 13 【課題】基板の縁部にプリウェット液が残留するのを防止する。【解決手段】めっき液に暴露される被めっき部と前記被めっき部の外側領域である縁部とを有する基板にめっき処理を施すためのめっき方法が提案される。かかるめっき方法は、基板に第１のシール体を接触させて前記基板の前記縁部をシールする第１シール工程と、シールされた前記基板にプリウェット処理を施すプリウェット工程と、プリウェット後の前記基板から前記第１のシール体を取り外す第１シール取外し工程と、前記基板を、第２のシール体を有する基板ホルダで保持する基板保持工程と、前記基板ホルダで保持された前記基板にめっき液を作用させるめっき工程と、を含む。【選択図】図１３