RESIN COMPOSITION, METAL FOIL WITH RESIN, PREPREG, LAMINATED PLATE, MULTILAYER PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

• Main Authors: SASAKI KAORI, SHINOZAKI HARUKA, SOMEKAWA ATSUO, NAKAMURA YUKIO, HIDAKA YOSHIKI, TABATA SHIORI
• Format: Patent
• Language: English; Japanese
• Published: 19.04.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a resin composition that develops excellent dielectric characteristics in a high frequency wavelength band of 10 GHz band or larger, suppresses powder drop at an end part during cutting of a metal foil with a resin, and is excellent in copper foil releasing strength, a metal foil with a resin using the resin composition, a prepreg, a laminated plate, a multilayer printed circuit board and a semiconductor package.SOLUTION: A resin composition containing a polyphenylene ether derivative (A), a fluororesin filler (B), and a titanate coupling agent (X), a metal foil with resin using the resin composition, a prepreg, a laminated plate, a multilayer printed wiring board and a semiconductor package.SELECTED DRAWING: None 【課題】１０ＧＨｚ帯以上の高周波数帯において優れた誘電特性を発現し、樹脂付き金属箔の切断時に端部の粉落ちが抑制され、且つ、銅箔引き剥がし強度に優れる樹脂組成物、該樹脂組成物を用いた樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージを提供すること。【解決手段】ポリフェニレンエーテル誘導体（Ａ）と、フッ素樹脂フィラー（Ｂ）と、チタネートカップリング剤（Ｘ）と、を含有する樹脂組成物、該樹脂組成物を用いた樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ。【選択図】なし