IMAGE READING APPARATUS AND WIRING METHOD

• Main Author: TAKAMATSU SEIJI
• Format: Patent
• Language: English; Japanese
• Published: 19.04.2022
• Subjects: ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION

To reduce the size of FFCs and products employing the FFCs.SOLUTION: An FFC connecting a sensor substrate and an AFE substrate includes a configuration in which a ground line connecting ground patterns, each of which is included in the sensor substrate and the AFE substrate, between a first conducting wire and a second conducting wire which are signal lines for transmitting a reading signal from the sensor substrate to the AFE substrate, and includes a configuration in which a third conducting wire with a voltage variation smaller than that of the signal lines between two signal lines which are at lest one set of the signal lines other than the set of the first conducting wire and the second conducting wire. Each of the signal wires is connected to the ground pattern of the sensor substrate via a capacitor and to the ground pattern of the AFE substrate via a capacitor, the third conducting wire is connected to the ground pattern of the sensor substrate via a capacitor and to the ground pattern of the AFE substrate via a capacitor.SELECTED DRAWING: Figure 2 【課題】ＦＦＣやＦＦＣを利用する製品の小型化が困難であった。【解決手段】センサー基板とＡＦＥ基板とを接続するＦＦＣは、センサー基板からＡＦＥ基板へ読取信号を送信する信号線である第１導線と第２導線との間に、センサー基板とＡＦＥ基板とが夫々に有するグラウンドパターンに接続するグラウンド線を挟む構成を含み、かつ、第１導線と第２導線との組以外の少なくとも一つの組である二つの信号線の間に、信号線よりも電圧変化が小さい第３導線を挟む構成を含み、信号線は夫々にセンサー基板のグラウンドパターンにコンデンサーを介して接続し且つＡＦＥ基板のグラウンドパターンにコンデンサーを介して接続し、第３導線はセンサー基板のグラウンドパターンにコンデンサーを介して接続し且つＡＦＥ基板のグラウンドパターンにコンデンサーを介して接続する。【選択図】図２