WORKPIECE PROCESSING METHOD

• Main Authors: HONGO TOMOYUKI, YOSHIKAWA TOSHIYUKI, TSUCHIYA TOSHIO
• Format: Patent
• Language: English; Japanese
• Published: 14.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a processing method which removes an area, including the chamfering part of a workpiece, using a laser beam while suppressing the return of the laser beam to a laser oscillator.SOLUTION: A processing method of a disc-like workpiece 11 in a laser machining device 2 includes: a tape pasting step which pastes a tape to one surfaces 11d of a workpiece to integrate the workpiece and a frame through the tape; a holding step which holds the workpiece by the holding unit through the tape; and a laser beam radiation step which radiates a pulse-shaped laser beam L, having a wavelength to be absorbed by the workpiece, from the other surface 11a of the workpiece, which is located opposite to one surfaces, to the other surface. In the laser beam radiation step, the laser beam L is radiated annularly on the other surface in a state that the orientation of the laser beam L is adjusted to have an incidence angle α which is inclined by a predetermined angle with respect to a normal line 11f of the other surface of the workpiece.SELECTED DRAWING: Figure 6 【課題】レーザー発振器へのレーザービームの戻りを抑制しつつ、レーザービームを用いて被加工物の面取り部を含む領域を除去する加工方法を提供する。【解決手段】レーザー加工装置２における円盤状の被加工物１１の加工方法であって、被加工物の一方の面１１ｄにテープを貼着すると共にテープを介して被加工物とフレームとを一体化するテープ貼着ステップと、テープを介して被加工物を保持ユニットで保持する保持ステップと、一方の面とは反対側に位置する被加工物の他方の面１１ａ側から他方の面へ、被加工物に吸収される波長を有するパルス状のレーザービームＬを照射するレーザービーム照射ステップと、を備える。レーザービーム照射ステップでは、被加工物の他方の面の法線１１ｆに対して所定角度だけ傾斜した入射角αを有する様にレーザービームＬの向きを調整した状態で、他方の面において環状にレーザービームＬを照射する。【選択図】図６