ELECTRONIC EQUIPMENT

To achieve both downsizing of equipment and stability of a sensor output in the electronic equipment in which a semiconductor package having a sensor part is mounted.SOLUTION: Electronic equipment 1 comprises a semiconductor package 2 having a sensor part 21 that outputs a signal in response to an a...

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Bibliographic Details
Main Authors HOCHI SUGURU, SAKURAI SHIGEKI, TERASAWA HIDEKI
Format Patent
LanguageEnglish
Japanese
Published 28.03.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:To achieve both downsizing of equipment and stability of a sensor output in the electronic equipment in which a semiconductor package having a sensor part is mounted.SOLUTION: Electronic equipment 1 comprises a semiconductor package 2 having a sensor part 21 that outputs a signal in response to an applied physical quantity, mounted on a mountable member 4. The area formed by projecting the outline of an island 241 on which the sensor part 21 is mounted on the mountable member 4 is an island projection area 41c, and part or all of the island projection area 41c is a through-hole 411 or a recess.SELECTED DRAWING: Figure 2 【課題】センサ部を有する半導体パッケージが搭載されてなる電子装置において、装置の小型化とセンサ出力の安定とを両立する。【解決手段】電子装置１は、印加された物理量に応じた信号を出力するセンサ部２１を有する半導体パッケージ２が被搭載部材４に搭載されてなる。被搭載部材４のうちセンサ部２１が搭載されたアイランド２４１の外郭を投影してできる領域をアイランド投影領域４１ｃとして、アイランド投影領域４１ｃは、その一部または全部が、貫通孔４１１または凹部となっている。【選択図】図２
Bibliography:Application Number: JP20200154596