POWER SUPPLY APPARATUS

• Main Authors: AOYAMA TAKAAKI, DAIKO YOSHINORI, MIYAUCHI MITSUSUKE
• Format: Patent
• Language: English; Japanese
• Published: 25.03.2022
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; GENERATION; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; SYSTEMS FOR STORING ELECTRIC ENERGY

To provide a power supply apparatus 31 capable of enhancing the power density of a substrate S to be treated to increase power efficiency when sequentially treating a plurality of substrates S in surface treatment performed to the substrates S having applied voltage, and a surface treatment machine 1 using the same.SOLUTION: A power supply apparatus 31 used for a surface treatment machine 1 for sequentially subjecting a plurality of substrates S to surface treatment and attached to a rotor 22 for supplying electric power to the substrates S supplies electric power supplied from a power supply 32 to the substrates S held on the rotor 22 and selectively switches power supply and non-power supply by the rotation angle of the rotor 22.SELECTED DRAWING: Figure 1 【課題】電圧を印加した基板Ｓに対して行う表面処理において、複数の基板Ｓを順次処理をする場合に、処理される基板Ｓの電力密度を高め、電力効率を上げることができる給電装置３１、及びこれを用いた表面処理機１を提供する。【解決手段】複数の基板Ｓに順次表面処理をする表面処理機１に用いられる給電装置３１であって、基板Ｓに電力を供給する回転体２２に取り付けられ、電源３２から供給される電力を回転体２２に保持された基板Ｓに供給し、回転体２２の回転角度によって、給電と非給電とを選択的に切り替える。【選択図】 図１