EXTERNAL ELECTRODE FORMING JIG, EXTERNAL ELECTRODE FORMING DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

• Main Authors: SASADA MANABU, NARUSE FUMIO, HIRAO SHODAI
• Format: Patent
• Language: English; Japanese
• Published: 25.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; INDUCTANCES; MAGNETS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS

To suppress the formation of an external electrode in an area other than an area where the external electrode is formed, when forming the external electrode on an electronic component element.SOLUTION: An external electrode forming jig 10 is equipped with a container 1, and a cover 2 with a size entering the container 1. A bottom surface 1a of the container 1 is provided with a first hole, and the cover 2 is provided with a second hole. On an inner wall of the first hole, a first elastic body 41 tightly contacted with an electronic component element 20 is provided, and on an inner wall of the second hole, a second electric body 42 tightly contacted with the electronic component element 20 is provided. The external electrode forming jig 10 is configured so that a filling space 50 filling a coated member covering an area except for a first end portion 21 and a second end portion 22 on a surface of the electronic component element 20 can be formed between the container 1 and the cover 2, while one end portion of the electronic component element 20 is inserted in the first hole of the container 1 and the other end portion of the electronic component element 20 is inserted in the second hole of the cover 2.SELECTED DRAWING: Figure 2 【課題】電子部品素体に外部電極を形成する際、外部電極を形成する領域以外の領域に、外部電極が形成されることを抑制する。【解決手段】外部電極形成用治具１０は、容器１と、容器１の内部に入る大きさの蓋２とを備える。容器１の底面１ａには、第１の孔が設けられており、蓋２には、第２の孔が設けられている。第１の孔の内壁には、電子部品素体２０と密着する第１の弾性体４１が設けられており、第２の孔の内壁には、電子部品素体２０と密着する第２の弾性体４２が設けられている。この外部電極形成用治具１０は、容器１の第１の孔に電子部品素体２０の一方の端部が挿入され、蓋２の第２の孔に電子部品素体２０の他方の端部が挿入された状態で、容器１と蓋２との間に、電子部品素体２０の表面のうちの第１の端部２１および第２の端部２２を除く領域を覆う被覆部材を充填するための充填スペース５０を形成可能に構成されている。【選択図】図２