RIGID SUBSTRATE, MANUFACTURING METHOD OF THE SAME, SUPPORT SUBSTRATE FOR SEMICONDUCTOR, AND AUXILIARY PLATE FOR POLISHING PAD

• Main Authors: AKIYAMA SEIJI, TANII SHOTA, MORINO AKINORI
• Format: Patent
• Language: English; Japanese
• Published: 18.03.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a rigid substrate that has high rigidity comparable to that of a glass epoxy substrate, suppresses warpage, and is less likely to produce cutting debris during cutting process.SOLUTION: The rigid substrate has at least an adhesive layer A1, a resin film layer B1 disposed on one main surface of the adhesive layer A1, and a resin film layer B2 disposed on the other main surface of the adhesive layer. The total thickness is greater than a predetermined value. The adhesive layer A1 is formed of a cured material of a predetermined adhesive composition. The thickness of the adhesive layer A1 and the storage modulus (E'25) of the adhesive layer A1 at 25°C measured at a frequency of 1.0 Hz are greater or equal to predetermined values. The thicknesses of the resin film layer B1 and the resin film layer B2 are each greater than or equal to a predetermined value.SELECTED DRAWING: Figure 1 【課題】ガラスエポキシ基板並みの高い剛性を有し、反りの発生が抑制され、さらに切削加工時に切削カスが生じにくいリジット基板を提供する。【解決手段】接着層Ａ１と、上記接着層Ａ１の一方の主面に配置された樹脂フィルム層Ｂ１と、上記接着層の他方の主面に配置された樹脂フィルム層Ｂ２と、を少なくとも有し、総厚が所定値以上であり、上記接着層Ａ１は、所定の接着剤組成物の硬化物で形成されており、上記接着層Ａ１の厚さ及び上記接着層Ａ１の周波数１．０Ｈｚで測定される２５℃での貯蔵弾性率（Ｅ'２５）が所定値以上であり、上記樹脂フィルム層Ｂ１及び上記樹脂フィルム層Ｂ２の厚さがそれぞれ所定値以上である、リジット基板を提供する。【選択図】図１