ALIGNMENT DEVICE, EXPOSURE DEVICE, AND ALIGNMENT METHOD

To obtain a displacement amount of a substrate with precision when a surface pattern of a holding surface is reflected in an image showing an alignment mark.SOLUTION: In a stage 10 of an alignment device, a substrate 9 is held by a holding surface 11 in a state where one main surface 91 on which an...

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Bibliographic Details
Main Authors NAKAI KAZUHIRO, HATANO AKITO
Format Patent
LanguageEnglish
Japanese
Published 10.03.2022
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Summary:To obtain a displacement amount of a substrate with precision when a surface pattern of a holding surface is reflected in an image showing an alignment mark.SOLUTION: In a stage 10 of an alignment device, a substrate 9 is held by a holding surface 11 in a state where one main surface 91 on which an alignment mark 911 is formed faces the holding surface 11. In an image pickup section 40, light of a wavelength transmittable through the substrate 9 is emitted toward another main surface 92 of the substrate 9 on the stage 10, and reflected light of the light from the holding surface 11 is received, thereby a mark imaging image showing the surface pattern of the holding surface 11 together with the alignment mark 911 are acquired. In an image processing section, a reference image showing the surface pattern of the area of the holding surface 11 indicated by the mark image is compared with the mark image, and thereby a processed image having reduced surface pattern in the mark image is generated. In a position displacement amount acquisition section, the positional deviation amount of the substrate 9 is accurately obtained based on the processed image.SELECTED DRAWING: Figure 3 【課題】アライメントマークを示す画像において保持面の表面模様が映り込む場合に、基板の位置ずれ量を精度よく取得する。【解決手段】アライメント装置のステージ10では、アライメントマーク911が形成された一の主面91が保持面11と対向した状態で基板9が保持面11により保持される。撮像部40では、ステージ10上の基板9の他の主面92に向けて、基板9を透過可能な波長の光を出射するとともに、保持面11からの当該光の反射光を受光することにより、アライメントマーク911と共に保持面11の表面模様を示すマーク撮像画像が取得される。画像処理部では、マーク撮像画像が示す保持面11の領域の表面模様を示す参照画像とマーク撮像画像とを比較することにより、マーク撮像画像において表面模様を低減した処理済み画像が生成される。位置ずれ量取得部では、処理済み画像に基づいて基板9の位置ずれ量が精度よく取得される。【選択図】図3
Bibliography:Application Number: JP20200144710