SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

• Main Author: KAI AKIKO
• Format: Patent
• Language: English; Japanese
• Published: 10.03.2022
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To form a processing film having a more uniform film thickness on the peripheral edge of a substrate.SOLUTION: A substrate processing method that forms a processing film on the peripheral portion of a substrate surface includes supplying a processing liquid for forming the processing film to the peripheral portion, and bring a molding solvent supplied to the inside of a region to which the processing liquid is supplied on the surface of the substrate into contact with the interface on the center side of the substrate of the processing liquid supplied to the peripheral portion.SELECTED DRAWING: Figure 5 【課題】基板の周縁部に膜厚がより均一な処理膜を形成する。【解決手段】基板表面の周縁部に対して処理膜を形成する基板処理方法であって、前記周縁部に前記処理膜を形成するための処理液を供給することと、前記基板表面のうち前記処理液が供給された領域よりも内側に供給された成形用溶剤を、前記周縁部に供給された前記処理液のうち前記基板の中央側の界面に接触させることと、を含む。【選択図】図５