POLISHING COMPOSITION

To provide a polishing composition that can polish polysilicon at a high polishing speed and has a sufficiently high ratio of the polysilicon polishing speed to the polishing speed of silicon oxide and silicon nitride.SOLUTION: A polishing composition has abrasive grains and collagen peptides with a...

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Bibliographic Details
Main Author MAE RYOTA
Format Patent
LanguageEnglish
Japanese
Published 10.03.2022
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
TRANSPORTING
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Summary:To provide a polishing composition that can polish polysilicon at a high polishing speed and has a sufficiently high ratio of the polysilicon polishing speed to the polishing speed of silicon oxide and silicon nitride.SOLUTION: A polishing composition has abrasive grains and collagen peptides with a weight average molecular weight of 2,000 or more and 100,000 or less, and has a pH of less than 4.0.SELECTED DRAWING: None 【課題】ポリシリコンを高い研磨速度で研磨でき、かつシリコン酸化物およびシリコン窒化物の研磨速度に対するポリシリコンの研磨速度の比が十分に高い研磨用組成物を提供する。【解決手段】砥粒と、重量平均分子量が２０００以上１０００００以下であるコラーゲンペプチドと、を含み、ｐＨが４．０未満である、研磨用組成物。【選択図】なし
Bibliography:Application Number: JP20200143709