LASER PROCESSING DEVICE

• Main Author: OGIWARA TAKAFUMI
• Format: Patent
• Language: English; Japanese
• Published: 04.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a laser processing device capable of shortening processing time when a modified region is formed in an object along each of a plurality of lines.SOLUTION: This laser processing device comprises a control unit. The control unit controls a spatial light modulator so that a laser beam L can branch into a first processing beam L1 and a second processing beam L2; a first condensing point C1 can be positioned on a first line 91; and a second condensing point C2 can be positioned on a second line 92. The control unit controls a moving mechanism so that an irradiation region R of a measurement beam L10 and the first and second condensing points C1, C2 can relatively move along the first and second lines 91, 92, and controls a drive unit so that the first and second condensing points C1, C2 can be respectively set at prescribed positions with respect to the surface 101a of an object 100. A distance measuring unit is configured to be able to adjust the position of the irradiation region R by an amount at least equal to a gap between the first and second lines 91, 92 in a Y direction.SELECTED DRAWING: Figure 9 【課題】複数のラインのそれぞれに沿って対象物に改質領域を形成する場合に、加工時間の短縮化を図ることができるレーザ加工装置を提供する。【解決手段】レーザ加工装置は、制御部を備える。制御部は、レーザ光Ｌが第１加工光Ｌ１及び第２加工光Ｌ２に分岐して、第１集光点Ｃ１が第１ライン９１上に位置し且つ第２集光点Ｃ２が第２ライン９２上に位置するように、空間光変調器を制御し、測距用の光Ｌ１０の照射領域Ｒ、並びに、第１集光点Ｃ１及び第２集光点Ｃ２が第１ライン９１及び第２ライン９２に沿って相対的に移動するように、移動機構を制御し、第１集光点Ｃ１及び第２集光点Ｃ２のそれぞれが対象物１００の表面１０１ａに対して所定位置に位置するように、駆動部を制御する。測距部は、Ｙ方向において少なくとも第１ライン９１と第２ライン９２との間隔の分だけ照射領域Ｒの位置を調整することが可能となるように、構成されている。【選択図】図９