BOARD TRANSFER DEVICE, BOARD PROCESSING DEVICE, AND BOARD TRANSFER METHOD

• Main Authors: CHOI BYOUNG DOO, HAN KI WON
• Format: Patent
• Language: English; Japanese
• Published: 25.02.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a board transfer device, a board processing device, and a board transfer method that can increase the board transfer speed.SOLUTION: A board transfer device according to an embodiment of the present invention includes transfer hands that suck and fix a board with vacuum pressure and are located at different heights, a vacuum pressure supply unit that supplies vacuum pressure to each of the transport hands, and a control unit that controls the vacuum pressure supply unit such that the vacuum pressure is supplied to and cut off from each of the transport hands, and the control unit can control the vacuum pressure supply unit such that the vacuum pressure off time of the transfer hand is performed at the same height from the board support member.SELECTED DRAWING: Figure 7 【課題】基板搬送速度を高めることができる基板搬送装置、基板処理装置、及び基板搬送方法を提供する。【解決手段】本発明は基板搬送装置に係る。本発明の一実施形態に係る基板搬送装置は真空圧で基板を吸着固定する、そして互いに異なる高さに位置する搬送ハンドと、前記搬送ハンドの各々に真空圧を供給する真空圧供給部と、真空圧が前記搬送ハンドの各々に供給及び遮断されるように前記真空圧供給部を制御する制御部と、を含み、前記制御部は前記搬送ハンドの真空圧オフ時点が基板支持部材から同一な高さで行われるように前記真空圧供給部を制御することができる。【選択図】図７