JOINING STRUCTURE AND JOINING METHOD

To provide a joining structure that holds a conductor.SOLUTION: A joining structure 1 in which a bus bar tip 10a of a bus bar 10 and a lead wire tip 20a of a coil lead wire 20 are joined by heat includes a resin member 30 that melts by heat, and the coil lead wire 20 is at least partially embedded i...

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Bibliographic Details
Main Author SETOGUCHI YUSUKE
Format Patent
LanguageEnglish
Japanese
Published 25.02.2022
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
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Summary:To provide a joining structure that holds a conductor.SOLUTION: A joining structure 1 in which a bus bar tip 10a of a bus bar 10 and a lead wire tip 20a of a coil lead wire 20 are joined by heat includes a resin member 30 that melts by heat, and the coil lead wire 20 is at least partially embedded in the coil lead wire 20 in a state of being joined to the bus bar 10, and the resin member 30 includes a heat reforming portion 32 at a portion abutting on the coil lead wire 20.SELECTED DRAWING: Figure 1 【課題】導体を保持する接合構造を提供する。【解決手段】バスバー１０のバスバー先端部１０ａと、コイル導線２０の導線先端部２０ａとが熱によって接合された接合構造１であって、熱によって溶融する樹脂部材３０を備え、コイル導線２０は、バスバー１０と接合された状態において、コイル導線２０に少なくとも一部が埋没しており、樹脂部材３０は、コイル導線２０に当接する部位に熱改質部３２を有する。【選択図】図１
Bibliography:Application Number: JP20200135856