HOT WATER SUPPLY SYSTEM

To provide a hot water supply system that can prevent damage applied to a compressor.SOLUTION: A hot water supply system 1 comprises: a vapor compression type heat pump circuit 10 in which a compressor 11, a first heat dissipation heat exchanger 12A, a second heat dissipation heat exchanger 12B, an...

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Bibliographic Details
Main Authors MITSU YUYA, OTANI KAZUYUKI
Format Patent
LanguageEnglish
Japanese
Published 16.02.2022
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Summary:To provide a hot water supply system that can prevent damage applied to a compressor.SOLUTION: A hot water supply system 1 comprises: a vapor compression type heat pump circuit 10 in which a compressor 11, a first heat dissipation heat exchanger 12A, a second heat dissipation heat exchanger 12B, an expansion valve 13, and a heat absorption heat exchanger 14 are annularly connected by a refrigerant circulation line L9, and heat is extracted in the first heat dissipation heat exchanger 12A and/or the second heat dissipation heat exchanger 12B by driving the compressor 11; a hot water storage tank 60 for storing makeup water W2; a water circulation line L1 for circulating stored water W3 in the hot water storage tank 60 through the first heat dissipation heat exchanger 12A; a makeup water line L2 for supplying the makeup water W2 to the hot water storage tank 60 while passing the makeup water through the second heat dissipation heat exchanger 12B; refrigerant temperature adjustment means 50 for adjusting a temperature of a liquid refrigerant R flowing into the expansion valve 13; and control means 100 for controlling the refrigerant temperature adjustment means 50.SELECTED DRAWING: Figure 1 【課題】圧縮機の破損を防止することが可能な給湯システムを提供する。【解決手段】給湯システム1であって、圧縮機11、第1放熱用熱交換器12A、第2放熱用熱交換器12B、膨張弁13および吸熱用熱交換器14が冷媒循環ラインL9により環状に接続され、圧縮機11の駆動により第1放熱用熱交換器12Aおよび/または第2放熱用熱交換器12Bで温熱を取り出す蒸気圧縮式のヒートポンプ回路10と、補給水W2を貯留する貯湯タンク60と、貯湯タンク60内の貯留水W3を第1放熱用熱交換器12Aに循環させる水循環ラインL1と、補給水W2を第2放熱用熱交換器12Bに流通させつつ、貯湯タンク60へ送給する補給水ラインL2と、膨張弁13に流入する液冷媒Rの温度を調整する冷媒温度調整手段50と、冷媒温度調整手段50を制御する制御手段100と、を備える。【選択図】図1
Bibliography:Application Number: JP20200131897