TERMINAL MATERIAL FOR CONNECTORS

To provide a terminal material for connectors that can achieve improved wear resistance and heat resistance.SOLUTION: This terminal material for connectors comprises: a substrate having at least a surface made of copper or a copper alloy; and a silver-nickel-potassium alloy plated layer formed on at...

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Bibliographic Details
Main Authors TARUTANI YOSHIE, KUBOTA KENJI, KATO NAOKI
Format Patent
LanguageEnglish
Japanese
Published 03.02.2022
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CURRENT COLLECTORS
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
LINE CONNECTORS
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:To provide a terminal material for connectors that can achieve improved wear resistance and heat resistance.SOLUTION: This terminal material for connectors comprises: a substrate having at least a surface made of copper or a copper alloy; and a silver-nickel-potassium alloy plated layer formed on at least a portion of the substrate, wherein the silver-nickel-potassium alloy plated layer has a thickness of 0.5-20.0 μm, has a nickel content of 0.02-0.60 mass%, has a potassium content of 0.03-1.00 mass%, and has preferably an average crystal grain size of 10-150 nm.SELECTED DRAWING: Figure 1 【課題】耐摩耗性及び耐熱性を向上できるコネクタ用端子材を提供する。【解決手段】少なくとも表面が銅又は銅合金からなる基材と、基材の上の少なくとも一部に形成された銀ニッケルカリウム合金めっき層と、を備え、銀ニッケルカリウム合金めっき層は、膜厚が０．５μｍ以上２０．０μｍ以下で、ニッケル含有量が０．０２質量％以上０．６０質量％以下、カリウム含有量が０．０３質量％以上１．００質量％以下であり、銀ニッケルカリウム合金めっき層の平均結晶粒径は１０ｎｍ以上１５０ｎｍ以下であるとよい。【選択図】図１
Bibliography:Application Number: JP20210015188