RESIN PARTICLE AND METHOD FOR PRODUCING RESIN PARTICLE

To provide resin particles having a small charge amount and good dispersibility to a hydrophobic material.SOLUTION: Resin particles contain resin base particles, and silica particles that exist on the surface of the resin base particles, contain a quaternary ammonium salt and have a surface subjecte...

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Main Authors ZENITANI YUKA, TAKEUCHI SAKAE, MIZUGUCHI TAKUHIRO, ERI YOSHIFUMI, SASAKI KOJI
Format Patent
LanguageEnglish
Japanese
Published 27.01.2022
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Summary:To provide resin particles having a small charge amount and good dispersibility to a hydrophobic material.SOLUTION: Resin particles contain resin base particles, and silica particles that exist on the surface of the resin base particles, contain a quaternary ammonium salt and have a surface subjected to hydrophobic treatment, in which when a detection temperature derived from a thermally decomposed material of the quaternary ammonium salt obtained by thermal decomposition mass analysis in the resin particles before cleaning is represented as detection temperature A, and a detection temperature derived from a thermally decomposed material of the quaternary ammonium salt obtained by thermal decomposition mass analysis in the resin particles after cleaning is represented as detection temperature B, a difference (detection temperature A-detection temperature B) between the detection temperature A and the detection temperature B is more than 50°C.SELECTED DRAWING: None 【課題】帯電量が少なく、且つ、疎水性材料への分散性が良い樹脂粒子の提供。【解決手段】樹脂母粒子と、前記樹脂母粒子の表面に存在し、四級アンモニウム塩を含有し、且つ、表面が疎水化処理されたシリカ粒子と、を有し、洗浄前の樹脂粒子における熱分解質量分析によって得られる四級アンモニウム塩の熱分解物に由来する検出温度を検出温度Aとし、洗浄後の樹脂粒子における熱分解質量分析によって得られる四級アンモニウム塩の熱分解物に由来する検出温度を検出温度Bとした場合における、前記検出温度Aと前記検出温度Bとの差(検出温度A-検出温度B)が50℃超過である樹脂粒子。【選択図】なし
Bibliography:Application Number: JP20200121632