POLYHYDRIC HYDROXY RESIN, METHOD OF PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION CONTAINING THE SAME, AND CURED EPOXY RESIN

• Main Authors: OMURA MASAMI, SHRESTHA NIRANJAN KUMAR, OGAMI KOICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 13.01.2022
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a polyhydric hydroxy resin and an epoxy resin composition that are excellent in reliability and are suitable as insulation materials for electric/electronic components, such as semiconductor sealing, laminates, heat-radiation substrates.SOLUTION: The present invention discloses a polyhydric hydroxy resin represented by general formula (1), the polyhydric hydroxy resin containing at least one ester structure, and an epoxy resin composition containing the same and a cured epoxy resin [where, X is an OH group or a polyhydric hydroxyaryl group having an ester structure, n is a number of larger than 0 and 20 or less].SELECTED DRAWING: None 【課題】信頼性に優れた半導体封止、積層板、放熱基板等の電気・電子部品用絶縁材料に有用な多価ヒドロキシ樹脂及びエポキシ樹脂組成物の提供。【解決手段】下記一般式（１）で表される多価ヒドロキシ樹脂であって、少なくとも一つのエステル構造を含有する多価ヒドロキシ樹脂、それを含むエポキシ樹脂組成物及びエポキシ樹脂硬化物。TIFF2022007637000010.tif33160〔ここで、ＸはＯＨ基またはエステル構造を含有する多価ヒドロキシアリール基を表し、ｎは０より大きく２０以下の数を示す。〕【選択図】なし