LASER CUTTING AND REMOVAL OF CONTOUR SET PROFILE FROM TRANSPARENT SUBSTRATE

• Main Authors: BRADLEY FREDERICK BOWDEN, THOMAS HACKERT, KRISTOPHER ALLEN WIELAND, GUO XIAOJU, GARRETT ANDREW PIECH
• Format: Patent
• Language: English; Japanese
• Published: 04.01.2022
• Subjects: CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METALLURGY; MINERAL OR SLAG WOOL; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS

To provide a method of cutting and dividing a profile of which contour is set inside a thin substrate, especially a glass substrate, to remove it, and a glass article obtained by the method.SOLUTION: A glass article includes a first main surface, a second main surface facing the first main surface, a circular inner periphery, and an outer periphery concentric with the inner periphery. The glass article includes a ring between the inner periphery and the outer periphery, a thickness of 1 mm or less, a first non-ground and non-polished edge part surface that is present between the first main surface and the second main surface and extends around the inner peripheral, and a second non-ground and non-polished edge part surface that is present between the first main surface and the second main surface and extends around the outer peripheral. At least one of the first edge part surface and the second edge part surface has an average surface roughness Ra of 0.5 micrometer or less.SELECTED DRAWING: None 【課題】薄型基板、特にガラス基板内の内部の輪郭設定された形状を、切断し、分割して取り外すための方法、および該方法により得られたガラス物品を提供する。【解決手段】ガラス物品は：第１の主表面；前記第１の主表面とは反対側の第２の主表面；円形内周；前記内周と同心の円形外周であって、前記内周及び上記外周は間に、環と、前記第１の主表面と前記第２の主表面との間に延在する、１ミリメートル以下の厚さと、前記第１の主表面と前記第２の主表面との間の、前記内周の周りに延在する第１の未研削かつ未研磨の縁部表面と、前記第１の主表面と前記第２の主表面との間の、前記外周の周りに延在する第２の未研削かつ未研磨の縁部表面とを画定する、円形内周を備え、前記第１の縁部表面及び前記第２の縁部表面のうちの少なくとも一方の平均表面粗度Ｒａは、０．５マイクロメートル以下である。【選択図】なし