DIP PROCESSING DEVICE AND MANUFACTURING METHOD OF ELECTRONIC PARTS USING THE SAME

To provide a dip processing device in which pores are less likely to occur in a baked body of a paste.SOLUTION: A dip processing device 101 includes a container 2 for storing a paste 1, a cage 51 capable of holding a component 10, and a drive unit 4 capable of displacing the cage 51 so that the comp...

Full description

Saved in:
Bibliographic Details
Main Authors TANAKA JUNYA, AOYAMA HIROYUKI, TAKENO MIKIO
Format Patent
LanguageEnglish
Japanese
Published 27.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
Online AccessGet full text

Cover

More Information
Summary:To provide a dip processing device in which pores are less likely to occur in a baked body of a paste.SOLUTION: A dip processing device 101 includes a container 2 for storing a paste 1, a cage 51 capable of holding a component 10, and a drive unit 4 capable of displacing the cage 51 so that the component 10 held by the cage 51 can move forward and backward relative to a liquid level 1u of the paste 1. The cage 51 is capable of holding the component 10 in a state where a lower end surface of the component 10 is tilted with respect to the liquid level 1u.SELECTED DRAWING: Figure 1 【課題】ペーストの焼成体の中にポアが生じにくいディップ処理装置を提供する。【解決手段】ディップ処理装置１０１は、ペースト１を貯留する容器２と、部品１０を保持することができる保持器５１と、保持器５１によって保持された部品１０がペースト１の液面１ｕに対して相対的に前進および後退することができるように、保持器５１を変位させることができる駆動部４とを備える。保持器５１は、液面１ｕに対して部品１０の下端面が傾斜した状態で部品１０を保持することが可能である。【選択図】図１
Bibliography:Application Number: JP20200104576