SUBSTRATE FIXING DEVICE, ELECTROSTATIC CHUCK, AND MANUFACTURING METHOD OF ELECTROSTATIC CHUCK

To obtain sufficiently high heat soaking property.SOLUTION: A substrate fixing device includes a base plate, and an electrostatic chuck that is fixed to the base plate and attracts a substrate by electrostatic force. The electrostatic chuck includes an adsorption layer formed of ceramic that comes i...

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Bibliographic Details
Main Authors TAKEMOTO KEIICHI, HARAYAMA YOICHI
Format Patent
LanguageEnglish
Japanese
Published 27.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Summary:To obtain sufficiently high heat soaking property.SOLUTION: A substrate fixing device includes a base plate, and an electrostatic chuck that is fixed to the base plate and attracts a substrate by electrostatic force. The electrostatic chuck includes an adsorption layer formed of ceramic that comes into contact with the substrate and adsorbs and holds the substrate, and a heating layer having uniform thickness as a whole laminated between the adsorption layer and the base plate, and heating the substrate held by the adsorption layer.SELECTED DRAWING: Figure 2 【課題】十分に高い均熱性を得ること。【解決手段】基板固定装置は、ベースプレートと、前記ベースプレートに固定され、静電力によって基板を吸着する静電チャックとを有し、前記静電チャックは、セラミックを用いて形成され、前記基板に接触して前記基板を吸着保持する吸着層と、前記吸着層と前記ベースプレートの間に積層された全体の厚さが均一の加熱層であって、前記吸着層によって保持される前記基板を加熱する加熱層とを有する。【選択図】図２
Bibliography:Application Number: JP20200104068