LDS THERMOSETTING RESIN COMPOSITION AND STRUCTURE

• Main Author: MITSUTA MASAYA
• Format: Patent
• Language: English; Japanese
• Published: 27.12.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; GENERAL PROCESSES OF COMPOUNDING; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide an LDS resin composition capable of reducing a wiring width and a wiring interval when forming a plating circuit layer by LDS and improving the surface smoothness of the plating circuit layer formed on a smooth laser treated surface of a resin.SOLUTION: An LDS thermosetting resin composition used for LASER DIRECT STRUCTURING (LDS) includes: (A) a thermosetting resin; (B) an inorganic filler; (C) a non-conductive metal compound forming a metal core by the irradiation of an active energy beam; and (D) a coupling agent. The component (A) includes one or more kinds selected from a group consisting of an epoxy resin and a bismaleimide resin; the d50 particle size of the inorganic filler (B) is 3 μm or less; and the d90 particle size of the inorganic filler (B) is 5 μm or less.SELECTED DRAWING: None 【課題】ＬＤＳによるめっき回路層形成の際に、配線幅および配線間隔を小さくすることができ、かつ樹脂のレーザー処理面が平滑であり、この上に形成されるめっき回路層の表面の平滑性を向上することができる、ＬＤＳ用樹脂組成物を提供する。【解決手段】ＬＡＳＥＲ ＤＩＲＥＣＴ ＳＴＲＵＣＴＵＲＩＮＧ（ＬＤＳ）に用いるＬＤＳ用熱硬化性樹脂組成物であって、（Ａ）熱硬化性樹脂と、（Ｂ）無機充填材と、（Ｃ）活性エネルギー線の照射により金属核を形成する非導電性金属化合物と、（Ｄ）カップリング剤と、を含み、前記成分（Ａ）が、エポキシ樹脂およびビスマレイミド樹脂からなる群から選択される１種以上を含み、前記無機充填材（Ｂ）のｄ５０粒径が、３μｍ以下であり、前記無機充填材（Ｂ）のｄ９０粒径が、５μｍ以下である、ＬＤＳ用熱硬化性樹脂組成物。【選択図】なし