ATOMIC DIFFUSION BONDING METHOD AND BONDING STRUCTURE

• Main Authors: MIYAMOTO YOSHIKAZU, KATO NOBUHIKO, MIYAMOTO KAZUO, SHIMAZU TAKEHITO, MORIWAKI TAKAYUKI, UOMOTO SACHI, SAITO TAKAYUKI
• Format: Patent
• Language: English; Japanese
• Published: 13.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To perform atomic diffusion bonding by a bonding film made of nitride formed on a bonding surface.SOLUTION: In a vacuum vessel, a bonding film made of nitride is formed on each smooth surface of two substrates having the smooth surface respectively, and the two substrates are overlaid so that each bonding film formed on the two substrates is brought into contact with each other, to thereby generate atomic diffusion on a bonding interface of each bonding film, and to bond the two substrates.SELECTED DRAWING: Figure 2 【課題】接合面に形成した窒化物から成る接合膜によって原子拡散接合を行う。【解決手段】真空容器内において，平滑面を有する２つの基体それぞれの前記平滑面に窒化物から成る接合膜を形成すると共に，前記２つの基体に形成された前記接合膜同士が接触するように前記２つの基体を重ね合わせることにより，前記接合膜の接合界面に原子拡散を生じさせることにより前記２つの基体を接合する。【選択図】図２