PHENOXY RESIN AND ITS APPLICATION

• Main Author: KASHINO TOMOMASA
• Format: Patent
• Language: English; Japanese
• Published: 02.12.2021
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a phenoxy resin excellent in adhesiveness with a substrate, inorganic particle or the like, and thermal conductivity, and its application.SOLUTION: A phenoxy resin contains repeating unit of general formula (1). In Formula 1, R1 to R4 are H, a halogen atom, a hydroxyl group, an amino group, or an alkyl, alkoxy or aryl group of C1 to C6. Q1 to Q4 are H, an alkyl or alkoxy group of C1 to C6. M is 0 or 1. X1, X2 are H or a group expressed by a general formula (2), at least one is the general formula (2). Z is an alkylene group of C2 to C10. R5 to R7 are alkoxy or alkyl group of C1 to C3, and at least one of them is an alkoxy group.SELECTED DRAWING: None 【課題】基材や無機粒子等との密着性、熱伝導性に優れたフェノキシ樹脂、及びその用途の提供。【解決手段】一般式（１）の繰り返し単位を含むフェノキシ樹脂。式中、Ｒ１〜Ｒ４はＨ、ハロゲン原子、水酸基、アミノ基、Ｃ数１〜６のアルキル、アルコキシまたはアリル基。Ｑ１〜Ｑ４はＨ、Ｃ数１〜６のアルキルまたはアルコキシ基。ｍは０または１。Ｘ１、Ｘ２はＨまたは一般式（２）で表される基で、少なくとも一方は一般式（２）。ＺはＣ数２〜１０のアルキレン基。Ｒ５〜Ｒ７は、Ｃ数１〜３のアルコキシまたはアルキル基で、少なくとも１つはアルコキシ基。【選択図】なし