LASER PEENING APPLICATION DEVICE AND LASER PEENING METHOD

• Main Authors: SENDA ITARU, TSUJI AKIHIRO, UENO SOICHI
• Format: Patent
• Language: English; Japanese
• Published: 02.12.2021
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a laser peening application device and the like, which enable confirmation of quality assurance to be obtained without actual measurement of compressive residual stress after application.SOLUTION: A laser peening application device comprises: an observation part that observes cavitation generated when an application object is subjected to peening by applying a pulse laser; a measurement part that measures a size and/or presence time of the cavitation from observation data from the observation part; and a display part that displays the result of measurement by the measurement part.SELECTED DRAWING: Figure 1 【課題】施工後に圧縮残留応力を実測すること無く、品質確保の確認がとれるレーザピーニング施工装置等を提供する。【解決手段】パルスレーザを照射して施工対象をピーニングした際に生じるキャビテーションを観察する観察部と、前記観察部からの観察データから前記キャビテーションのサイズ、及び／又は、存在時間を計測する計測部と、前記計測部による計測結果を表示する表示部と、を備えるレーザピーニング施工装置。【選択図】図１